Photon Basicware is a full-stack solution for automotive basic software developed by CUSTOMS, covering operating system kernel (PhotonOS), middleware (Photon Middleware) and development toolchain. 

RapidECU-S5 is a new generation of high-performance controller for chassis domain control. Equipped with Infineon-TC397 hexa-core microcontroller, with up to 300Mhz main frequency and 16MByte large memory space, it supports Ethernet communication and can store and run all kinds of complex chassis domain application control software to satisfy more demanding safety application scenarios.

China's first automotive-grade MCU to support ISO 26262 ASIL-B level functional safety product certification.

The world's first front view sensing 8M module, currently the world's first market share.

Support customised development of customer functions, support OTA, to meet the rapid iteration of software.

RPA+AI realises supreme limited production of data annotation, the earliest systematic and large-scale commercial automatic driving data annotation platform in China.

 1000V output, 20, 30, 40kW charging module, obtain the national standard, European standard, American standard certification.

It is a full-stack self-research Hiparking auto-parking algorithm, which can complete a variety of extreme scenarios and conditions of fully automatic fusion parking and remote control parking and other functions.

Witric is the world's leading supplier of high power wireless charging technology, focusing on providing efficient, safe and reliable wireless charging solutions for smart cars, intelligent transport and future mobility.

Integration of body controller (BCM), keyless control system (PEPS), tyre pressure system (TPMS), power tailgate control system (PLG), etc., integrated and unified management of each actuator, reasonable and effective distribution of system resources.

Adopting Class 1 ceramic dielectric, breaking through the bottleneck of large-size high-capacitance and high-voltage technology, and the performance is comparable to Japanese competitors.

A high-performance semiconductor material with excellent thermal conductivity, low coefficient of expansion, high strength and excellent resistance to high temperature and chemical corrosion, suitable for high-power electronic devices, automotive electronics, semiconductor packaging and other harsh environments.